Orientation and Growth of Grains in Copper‐Activated Hot‐Pressed Hexagonal Boron Nitride
Orientation and Growth of Grains in Copper‐Activated Hot‐Pressed Hexagonal Boron Nitride
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DOI：
10.1111/j.1151-2916.1996.tb07911.x
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发表时间：
1996
影响因子：
3.9
通讯作者：
M. Hubácek;M. Ueki;Tadao Satô
中科院分区：
文献类型：
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作者：
M. Hubácek;M. Ueki;Tadao Satô
在金属铜气氛中对六方氮化硼粉末进行热压成型。当与无铜系统相比时，暴露于铜的烧结体由具有不寻常排列的显著更厚的晶粒组成，所述不寻常排列由平行于压力轴的（0001）基面的优选排列组成。氮化硼晶粒的取向特性对陶瓷的机械强度有很大的影响。晶粒取向的差异是由铜原子和氮化硼晶体之间的相互作用选择性地发生在后者的（0001）基面上来解释的。
Hexagonal boron nitride powder was hot pressed in an environment of metallic copper. When compared with a copper-free system, the sintered body exposed to the copper was composed of substantially thicker grains having an unusual arrangement, consisting of preferred alignment of (0001) basal planes parallel to the pressure axis. The character of the orientation of the boron nitride grains substantially influenced the mechanical strength of the ceramics. The difference in the orientation of the grains is explained by the interaction between copper atoms and boron nitride crystals selectively occurring on the (0001) basal planes of the latter.