Laser-micromachined and laminated microfluidic components for miniaturized thermal, chemical, and biological systems
Laser-micromachined and laminated microfluidic components for miniaturized thermal, chemical, and biological systems
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DOI：
10.1117/12.341279
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发表时间：
1999-03
期刊：
影响因子：
--
通讯作者：
P. Martin;D. Matson;W. Bennett;D. C. Stewart;Yuehe Lin
中科院分区：
文献类型：
--
作者：
P. Martin;D. Matson;W. Bennett;D. C. Stewart;Yuehe Lin
微通道微流控组件正在开发用于传热、化学反应器、化学分析和生物分析应用。具体应用包括化学传感、DNA复制、血液分析、毛细管电泳、燃料电池反应器、高温化学反应器、热泵、燃烧器和燃料处理器。已经开发了两种通用类型的组件架构，并定义了制造过程。所有这些都涉及使用塑料、陶瓷或金属层压板的层压方案，而不是平面组件。第一种类型是堆叠架构，其利用在每层中构建的功能，在层之间具有流体流动互连。层压材料的每一层都具有特定的微通道几何形状，并执行特定的功能。主要使用聚合物材料。所使用的制造工艺是激光微加工、湿法和干法蚀刻以及涂层沉积。层压材料也可以是微模塑塑料。第二种结构采用层压材料来形成内部微通道和互连。材料包括陶瓷带和高温金属。催化剂可以放置在微通道中。制造过程中使用的扩散结合，陶瓷结合和烧制，光化学蚀刻，和电化学微加工。层压材料的粘合，从而密封是一个重要的问题。已经开发了工艺条件来减少层压件的变形并气密密封部件。
Microchannel microfluidic components are being developed for heat transfer, chemical reactor, chemical analysis, and biological analytical applications. Specific applications include chemical sensing, DNA replication, blood analysis, capillary electrophoresis, fuel cell reactors, high temperature chemical reactors, heat pumps, combustors, and fuel processors. Two general types of component architectures have been developed and the fabrication processes defined. All involve a lamination scheme using plastic, ceramic, or metal laminates, as opposed to planar components. The first type is a stacked architecture that utilizes functionality built in each layer, with fluid flow interconnects between layers. Each layer of the laminate has specific microchannel geometry, and performs a specific function. Polymeric materials are used primarily. Fabrication processes used are laser micromachining, wet and dry etching, and coating deposition. the laminates can also be micromolded plastics. The second architecture employs laminates to form internal microchannels and interconnects. Materials include ceramic tapes and high temperature metals. Catalysts can be placed in the microchannels. Fabrication processes used are diffusion bonding, ceramic bonding and firing, photochemical etching, and electrochemical micromachining. Bonding, thus sealing, the laminates is an important issue. Process conditions have been develop to reduce distortion of the laminates and to hermetically seal the components.