Solder Fatigue Problems in Power Packages
Solder Fatigue Problems in Power Packages
复制标题
电源封装中的焊接疲劳问题
DOI：
10.1109/tchmt.1984.1136381
复制
发表时间：
1984
期刊：
影响因子：
--
通讯作者：
H. Webster
中科院分区：
文献类型：
--
作者：
J. Burgess;R. Carlson;H. Glascock;C. Neugebauer;H. Webster
对电源封装中焊料连接的疲劳进行了研究。功率器件使用较大的粘合面积，这会导致疲劳寿命问题。对由连接到铜散热器的硅二极管组成的三种不同类型的结构进行了热循环，并对粘合的完整性进行了比较。从硅二极管到散热器的热阻已用于测量粘合质量。在硅芯片和铜散热器（II 型）之间使用 n BeO 应变缓冲器提高了焊接循环寿命。在 BeO 和铜沉降片之间进一步添加一层结构化铜（III 型）可显着提高循环寿命。热阻快速上升表明疲劳失效，这表明硅和散热器之间的一个键出现裂纹或撕裂。该模型已通过超声波显微镜扫描得到证实。焊料疲劳寿命还通过使用硬焊料、压缩力和气密性得以延长。
The fatigue of solder connections in power packaging has been investigated. Power devices use large bond areas which lead to fatigue life problems. Three different types of structures consisting of silicon diodes attached to copper heatsinks have been thermally cycled and the integrity of the bonds compared. The thermal resistance from the silicon diode to its heatsink has been used to measure bond quality. Use of n BeO strain buffer between the silicon chip and the copper heatsink (Type II) improved the solder cycle life. Further addition of a layer of structured copper between the BeO and the copper sink (Type III resulted in marked additional improvement in cycle life. Fatigue failure was indicated by a rapid rise in the thermal resistance that suggested a crack or tear in one of the bonds between the silicon and the heat sink. This model has been confirmed by an ultrasonic microscope scan. Solder fatigue life was also extended by the use of hard solders, compressive forces, and hermeticity.