Spectroscopic imaging of x-rays : a new look
Spectroscopic imaging of x-rays : a new look
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X 射线光谱成像：新面貌
DOI：
10.1109/nssmic.2003.1352036
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发表时间：
2003
期刊：
影响因子：
--
通讯作者：
E. Heijne
中科院分区：
文献类型：
--
作者：
E. Heijne
在最近的混合成像设备中，分段（50-100/spl mu/m）的半导体传感器矩阵与以某种标准硅CMOS技术制成的单独的读出芯片相匹配。大量的接触是由高密度凸块键合互连技术。在每个电子单元中具有数百个晶体管的扩展功能可以用于各种目的。传感器矩阵的响应中的波动可以被实时补偿。每个像素中的单个光子处理电路即使在高速率下也可以通过能量测量来实现光谱成像。然而，有必要考虑相邻像素上的信号分布。另一种可能性是通过增加吸收的堆叠层中的光子转换的能量来区分。
In recent hybrid imaging devices a segmented (50-100/spl mu/m) semiconductor sensor matrix is matched to a separate readout chip made in some standard silicon CMOS technology. The large number of contacts are made by high-density bump bonding interconnect technology. Extended functionality with hundreds of transistors in each electronics cell can serve a variety of purposes. Fluctuations in the response of the sensor matrix ran be compensated in real-time. A single photon processing circuit in each pixel can achieve spectroscopic imaging by energy measurement even at high rates. However, it is necessary to take into account the distribution of the signals over adjacent pixels. Another possibility is the discrimination by energy of photon conversions in stacked layers with increasing absorption.