Silicidation of Niobium Deposited on Silicon by Physical Vapor Deposition
Silicidation of Niobium Deposited on Silicon by Physical Vapor Deposition
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物理气相沉积在硅上沉积铌的硅化物
DOI:
10.1149/1.3609845
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发表时间:
2011
影响因子:
3.9
通讯作者:
D. Gu
中科院分区:
文献类型:
--
作者:
C. Ndoye;K. Tapily;M. Orlowski;H. Baumgart;D. Gu
Niobium was deposited by physical vapor deposition (PVD) using e-beam evaporation on bare (100) silicon substrates and SiO2 surfaces. The formation of niobium silicide was investigated by annealing PVD Nb films in the temperatures range 400–1000°C. At all elevated annealing temperatures the resistivity of Nb silicide is substantially higher than that of Nb. The Nb silicidation as a function of temperature has been investigated and different NbXSiy compounds have been characterized. It has been observed that the annealing of the Nb film on Si is accompanied by a strong volume expansion of about 2.5 of the resulting reacted film. The films' structural properties were studied using X-Ray diffraction (XRD), energy dispersive X-ray spectroscopy (EDS), and atomic force microscopy (AFM), which was not previously presented in the context of the extant NbSi literature. The X-Ray diffraction characterization of the Nb on Si sample annealed at 1000°C, showed the presence of hexagonal Nb5Si3 phases, with a dominant peak at the (200) plane, and NbSi2 phases. Fractal dimension calculations indicate a distinct transition from Stranski-Krastanov to Volmer-Weber film growth for NbSi formation at the annealing temperature of 600°C and above.