Surface heat balance and pan evaporation trends in Eastern Asia in the period 1971–2000

Surface heat balance and pan evaporation trends in Eastern Asia in the period 1971–2000
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DOI:
10.1002/hyp.5668
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发表时间:
2005-03
影响因子:
3.2
通讯作者:
Jianqing Xu;S. Haginoya;Kazuyuki Saito;K. Motoya
Jianqing Xu;S. Haginoya;Kazuyuki Saito;K. Motoya
中科院分区:
地球科学3区
文献类型:
--
作者:
Jianqing Xu;S. Haginoya;Kazuyuki Saito;K. Motoya

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使用 1971 年至 2000 年期间 32 个点的气象数据分析了包括青藏高原在内的东亚地区的气候变化。按照 Kondo 和 Xu 的建议(1997a,b),使用潜在蒸发 EP 和湿度指数 WI 来检查热量和水平衡的变化。湿润指数识别的东亚气候带,包括湿润、半湿润、半干旱和干旱气候类型,与植被分布相匹配。 30年来月平均气温有所上升,其中二月份增幅最大。总体而言,北方气温上升幅度大于南方。中国北方气温升高超过0·05 K yr−1。数据显示,近年来昼夜温差有所下降。从青藏高原,经过中国中部,到中国东北南部,潜在蒸发量和蒸发盘蒸发量均有所增加,这可能与气温升高和地表水缺乏有关。长波辐射通量的增加在每个月和年际趋势中都很明显。这与太阳辐射通量形成对比。另一方面,相对湿度和云量的趋势为负,但水蒸气压的趋势为正。版权所有 © 2005 约翰·威利父子有限公司
Climatic variations over Eastern Asia, including the Tibetan Plateau, were analysed using meteorological data for 32 points in the period 1971 to 2000. Changes in heat and water balances were examined using potential evaporation EP, and a wetness index WI, as suggested by Kondo and Xu ( 1997a,b ). Climate zones, including the humid, semi‐humid, semi‐arid and arid climate types, in Eastern Asia identified by the wetness index matched the vegetation distribution. Average monthly temperatures increased over the 30 years, with the sharpest increase in February. In general, temperature increases were larger in the north than in the south. Air temperature increased by more than 0·05 K yr−1 in northern China. The data showed that diurnal temperature ranges have decreased in recent years. From the Tibetan Plateau, through central China, to southern northeast China, there has been an increase in potential evaporation and pan evaporation, which may be related to both higher temperatures and a lack of surface water. Increasing long‐wave radiation flux is apparent in every month and in the interannual trends. This is in contrast to the solar radiation flux. On the other hand, trends for relative humidity and cloud cover were negative, but positive for water vapour pressure. Copyright © 2005 John Wiley & Sons, Ltd.