Comprehensive Study on the Interactions of Multiple Die Shift Mechanisms During Wafer Level Molding of Multichip-Embedded Wafer Level Packages
Comprehensive Study on the Interactions of Multiple Die Shift Mechanisms During Wafer Level Molding of Multichip-Embedded Wafer Level Packages
复制标题
多芯片嵌入式晶圆级封装晶圆级成型过程中多个芯片移位机构相互作用的综合研究
DOI：
10.1109/tcpmt.2014.2316019
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发表时间：
2014
期刊：
影响因子：
--
通讯作者：
Xiaowu Zhang
中科院分区：
文献类型：
--
作者：
H. Ling;Bu Lin;C. Choong;Sorono Dexter Velez;C. T. Chong;Xiaowu Zhang
对多芯片嵌入式圆片级封装的12英寸圆片级成型工艺中的芯片移位问题进行了全面的数值和实验分析。所提出的建模方法考虑了主要的机械和模具流动机制的现象。在模制温度下附接到模具带上的裸片的粘附行为的实验表征表明，模具带行为是裸片移位的重要促成因素，并且需要考虑高温下的模具带行为以改进裸片移位预测。通过对模带粘附特性的分析，将改进后的数值模型计算得到的模带移动量与实验结果进行了比较，两者具有较好的相关性。从调查中发现，机械效应，如模具板的热膨胀系数和化学收缩可以贡献高达85%的模具移位，而流体力占其余部分。
Comprehensive numerical and experimental analyses were performed to investigate the issue of die shift during the 12-in wafer level molding process of multichip-embedded wafer level packages. The proposed modeling methodology considers the major mechanical and mold flow mechanisms in the phenomenon. Experimental characterization of the adhesion behavior of a die attached on mold tape at molding temperature suggests that mold tape behavior is an important contributing factor to die shift and the mold tape behavior at high temperature needs to be considered for improved die shift prediction. Incorporating the characteristics of the mold tape adhesion behavior, the die shift obtained from the improved numerical model is compared with the experimental observations and a good correlation is observed. From the investigation, it was found that mechanical effects such as coefficient of thermal expansion of the mold plate and chemical shrinkage can contribute up to 85% of the die shift while fluidic force accounts for the rest.