Novel hepatocyte culture system developed using microfabrication and collagen/polyethylene glycol microcontact printing
Novel hepatocyte culture system developed using microfabrication and collagen/polyethylene glycol microcontact printing
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DOI：
10.1016/j.biomaterials.2005.07.031
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发表时间：
2006-10-01
期刊：
影响因子：
14
通讯作者：
Nakazawa, K
中科院分区：
文献类型：
--
作者：
Fukuda, J;Sakai, Y;Nakazawa, K
更好地理解细胞生物学和细胞通讯需要新的培养系统，更好地代表组织和器官中的自然细胞环境。我们开发了一种球形类器官（球形）微阵列培养系统，结合了微加工和微接触印刷。该系统由一个芯片组成，该芯片具有直径为300个圆柱腔，密度为700个腔/厘米(2)。这些空腔的底面被定义为支持或抑制细胞粘附的两个不同区域。在细胞粘附区，用胶原蛋白（Col）修饰100针直径的空腔底面中心，在非粘附区，除Col斑点外，空腔周围的整个区域用聚乙二醇修饰。原代肝细胞在芯片上每个空腔的中心自发形成直径均匀的球体。形成球体的肝细胞具有立方体的细胞形状，与体内的肝细胞相似，并稳定维持肝脏特异性表型，如富肝转录因子、白蛋白分泌、尿素循环酶和细胞间粘附分子。该培养体系可作为细胞生物学基础研究和组织工程应用的细胞平台。(c) 2005 Elsevier Ltd版权所有。
The better understanding of cell biology and cell communication requires novel culture systems that better represent the natural cell environment in tissues and organs. We developed a spherical organoid (spheroid) microarray culture system using a combination of micro fabrication and microcontact printing. The system consisted of a chip that had cylindrical cavities of 300 put diameter at a density of 700 cavities/cm(2). The bottom faces of these cavities were defined as two different regions that either supported or inhibited cell adhesion. In the cell adhesion region, the center of the bottom face of a 100 pin diameter in a cavity was modified with collagen (Col), and in the non-adhesion region, the entire region around the cavity, except the Col spots, was modified with polyethylene glycol. Primary hepatocytes spontaneously formed spheroids with a uniform diameter at the center of each cavity on the chip. Hepatocytes forming spheroids had a cuboidal cell shape, similar to hepatocytes in vivo, and stably maintained liver-specific phenotypes, such as liver-enriched transcriptional factors, albumin secretion, urea cycle enzymes, and intercellular adhesion molecules. This novel culture system may be applicable as a cellular platform for fundamental studies in cell biology and tissue engineering applications. (c) 2005 Elsevier Ltd. All rights reserved.