Improved combined tangential formulation for electromagnetic analysis of penetrable bodies
Improved combined tangential formulation for electromagnetic analysis of penetrable bodies
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DOI：
10.1364/josab.32.001780
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发表时间：
2015-09
影响因子：
1.9
通讯作者：
D. M. Solís;J. M. Taboada;Ó. Rubiños-López;F. Obelleiro
中科院分区：
文献类型：
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作者：
D. M. Solís;J. M. Taboada;Ó. Rubiños-López;F. Obelleiro
表面积分方程（SIE）方法是一种最流行的数值方法，用于任何类型的均匀和分段均匀的电介质，金属或复合材料的对象的电磁分析。这项工作的重点是切向公式（通常比正常的更准确），特别注意他们的能力，在光学和准光学频率的金属等离子体行为的建模，其中局域表面等离子体共振（LSPR）带来了显着的精度问题。作者提出了一种新的切向SIE，改进的组合切向公式（ICTF），其中的快速收敛行为的原始CTF相结合的高精度，因为新的ICTF的第一类性质。一些数值结果表明，所提出的配方的行为和准确性，即使在处理高度共振等离子体激元问题。
The surface integral equation (SIE) method is one of the most popular numerical methods for the electromagnetic analysis of any kind of homogeneous and piecewise homogeneous dielectric, metallic, or composite objects. This work focuses on the tangential formulations (usually more accurate than the normal ones), paying special attention to their capability of modeling the plasmonic behavior of metals at optical and quasi-optical frequencies, in which the localized surface plasmon resonances (LSPRs) bring out significant accuracy problems. The authors present a new tangential SIE, the improved combined tangential formulation (ICTF), in which the fast convergence behavior of the original CTF is combined with a high accuracy, because of the first-kind nature of the new ICTF. Some numerical results are shown to illustrate the behavior and accuracy of the proposed formulation, even when dealing with highly resonant plasmonic problems.