Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention.
Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention.
复制标题
超声波辅助焊接镁/锡基焊料/镁接头中高密度锡晶须的快速形成和生长：现象、机理和预防。
DOI：
10.1038/srep27522
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发表时间：
2016-06-08
影响因子：
4.6
通讯作者：
Yang SH
中科院分区：
文献类型：
--
作者：
Li MY;Yang HF;Zhang ZH;Gu JH;Yang SH
普遍适用的方法促进高密度锡须形成和快速增长的焊料是由制造毫克/所以Sn-based焊料/ Mg关节使用超声焊接在250°C 6 s,然后受到热老化25°C 7 d。结果表明,所以使用超声焊接可以生产Mg的过饱和溶解在液体中锡和铅的存在两种形式的Mg在Sn凝固。此外，两种Mg形态在固体Sn中的特殊贡献促进了高密度晶须的形成和生长。其中，间隙Mg可以为Sn晶须的生长提供持续的动力，而Mg2Sn相可以增加Sn晶须的形成概率。此外，我们还发现少量Zn（≥3wt）的加入可以显著抑制Sn基钎料中Sn晶须的形成和生长。%)，防止机制归因于锌原子在晶界或相界的偏析以及焊料中片状富锌结构的形成。
A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder.