Study of Bonding Technology Using Silver Nanoparticles
Study of Bonding Technology Using Silver Nanoparticles
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DOI：
10.1143/jjap.47.6615
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发表时间：
2008-08
影响因子：
1.5
通讯作者：
T. Morita;E. Ide;Y. Yasuda;A. Hirose;K. Kobayashi
中科院分区：
文献类型：
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作者：
T. Morita;E. Ide;Y. Yasuda;A. Hirose;K. Kobayashi
我们研究了一种利用纳米级颗粒在高温环境中使用的新型键合技术。我们的研究结果表明，该方法可以通过同时施加热量和压力来形成键。此外，与传统的pb - 5sn焊料键相比，纳米颗粒基键在250°C的高温保温1000小时后，键合强度没有下降，其放电特性改善（即增加）了三倍。可以将这种粘合技术扩展到安装在高温环境中运行的设备中的组件，例如，它可以用于安装碳化硅（SiC）设备等组件，这些组件预计将应用于温度超过250°C的环境中。
We investigated a new bonding technique utilizing nano-scaled particles for use in high-temperature environments. The results of our investigations revealed that the method could be used to form bonds by simultaneously applying heat and pressure. Moreover, compared to a conventional Pb–5Sn-solder bond, a nanoparticle-based bond suffered no degradation in bonding strength over an elevated-temperature holding period of 1000 h at 250 °C, and its discharge characteristics were improved (i.e., increased) threefold. It is possible to extend this bonding technique to mounting components in devices that operate in high-temperature environments, e.g., it can be used to mount components such as silicon carbide (SiC) devices, which are expected to be applied in environments with temperatures exceeding 250 °C.