Controlling Electrospun Nanofiber Morphology and Mechanical Properties Using Humidity
Controlling Electrospun Nanofiber Morphology and Mechanical Properties Using Humidity
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DOI：
10.1002/polb.22371
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发表时间：
2011-12-15
影响因子：
--
通讯作者：
McCutcheon, Jeffrey R.
中科院分区：
文献类型：
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作者：
Huang, Liwei;Nhu-Ngoc Bui;McCutcheon, Jeffrey R.
静电纺丝是一种纤维纺丝技术，用于生产具有优异互连性和比表面积的纳米级聚合物纤维。纤维直径、表面形态和机械强度是电纺丝纤维的重要特性，可用于多种应用。在这项研究中，作者研究了静电纺丝过程中的湿度如何影响纤维垫的这些特定性能。使用两种以前未研究过的聚合物，聚丙烯腈（PAN）和聚砜（PSU）溶解在N， N-二甲基甲酰胺（DMF）中，实验结果表明，纺丝过程中的湿度增加会导致纤维直径增加和机械强度下降。此外，在高相对湿度（RH）的大气中静电纺丝时，表面特征如粗糙度或孔隙变得明显。但是，PAN和PSU纤维受到的影响不同。无论相对湿度如何，PAN的纤维直径分布都较窄，而PSU在高相对湿度下的纤维直径分布更宽，双峰性更强。此外，在高湿条件下纺丝的PSU纤维表现出表面孔隙和更高的比表面积，而PAN纤维表现出表面粗糙度增加，但没有可见的孔隙。这些纤维形态是由非溶剂（水）、吸湿溶剂（DMF）和聚合物之间的复杂相互作用引起的。(C) 2011 Wiley期刊公司[J] .高分子材料科学与工程学报，2011,31 (4):444 - 444
Electrospinning is a fiber spinning technique used to produce nanoscale polymeric fibers with superior interconnectivity and specific surface area. The fiber diameter, surface morphology, and mechanical strength are important properties of electrospun fibers that can be tuned for diverse applications. In this study, the authors investigate how the humidity during electrospinning influences these specific properties of the fiber mat. Using two previously uninvestigated polymers, poly(acrylonitrile) (PAN) and polysulfone (PSU) dissolved in N, N-Dimethylformamide (DMF), experimental results show that increasing humidity during spinning causes an increase in fiber diameter and a decrease in mechanical strength. Moreover, surface features such as roughness or pores become evident when electrospinning in an atmosphere with high relative humidity (RH). However, PAN and PSU fibers are affected differently. PAN has a narrower distribution of fiber diameter regardless of the RH, whereas PSU has a wider and more bimodal distribution under high RH. In addition, PSU fibers spun at high humidity exhibit surface pores and higher specific surface area whereas PAN fibers exhibit an increased surface roughness but no visible pores. These fiber morphologies are caused by a complex interaction between the nonsolvent (water), the hygroscopic solvent (DMF), and the polymer. (C) 2011 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 49: 1734-1744, 2011