Self-assembly of three dimensional micro mechanisms using thermal shrinkage of polyimide
Self-assembly of three dimensional micro mechanisms using thermal shrinkage of polyimide
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DOI：
10.1007/s00542-006-0303-z
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发表时间：
2007-05-01
影响因子：
2.1
通讯作者：
Takanobu, Hideaki
中科院分区：
文献类型：
--
作者：
Suzuki, Kenji;Yamada, Hideaki;Takanobu, Hideaki
本文介绍了一种简单的自组装工艺，涉及聚酰亚胺的热收缩制造的三维微结构。所提出的方法使得铰接结构能够自动旋转出晶片平面并且保持弯曲，而不需要使用任何互锁机构。铰链结构的制造使用表面微机械加工技术，包括在炉中加热。随着加热温度、加热时间和聚酰亚胺铰链长度的增加，观察到由于聚酰亚胺收缩而导致的弯曲角度增加。在这三个参数中，加热时间被认为是最适合于精确控制弯曲角度。此外，通过这种方法制备的微立方体和自组装过程中成功地使用CCD相机可视化。
This paper describes three-dimensional microstructures fabricated using a simple self-assembly process involving the thermal shrinkage of polyimide. The proposed method enables hinged structures to be automatically rotated out of the wafer plane and to remain bent without the need to use any interlocking mechanisms. The hinged structures were fabricated using surface micromachining techniques involving heating in a furnace. An increase in the bending angle due to the shrinkage of polymide was observed with increasing heating temperature, heating time, and length of the polyimide hinge. Of these three parameters, the heating time was found to be the most suitable for precise control of the bending angle. Furthermore, microcubes were fabricated by this method and the self-assembly process was successfully visualized using a CCD camera.