Wetting and interface microstructure between Sn–Zn binary alloys and Cu
Wetting and interface microstructure between Sn–Zn binary alloys and Cu
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DOI：
10.1557/jmr.1998.0391
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发表时间：
1998-10
影响因子：
2.7
通讯作者：
K. Suganuma;K. Niihara;Takeshi Shoutoku;Y. Nakamura
中科院分区：
文献类型：
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作者：
K. Suganuma;K. Niihara;Takeshi Shoutoku;Y. Nakamura
Sn-Zn 二元合金已被检验为无铅焊料。 Zn 以片状分布在 Sn 基体中。亚共晶合金在 DTA 中显示出两个吸热峰，对应于共晶温度和液相线温度。不含Sn的Sn-Zn/Cu界面处形成三个反应层：与焊料相邻的厚γ-Cu_5Zn_8、中间的薄β'-CuZn以及与Cu相邻的最薄层。虽然由于润湿不良而在界面处形成许多非润湿区域和空隙，但在290℃下焊接可形成刚性界面，拉伸强度达到40MPa左右。
Sn–Zn binary alloys have been examined as a lead-free solder. Zn distributes in a Sn matrix as platelets. The hypoeutectic alloys show two endothermic peaks in DTA, which correspond to the eutectic and the liquidus temperatures. Three reaction layers are formed at the Sn–Zn/Cu interface without containing Sn: the thick γ–Cu_5Zn_8 adjacent to the solder, the thin β′–CuZn in the middle, and the thinnest layer adjacent to Cu. Although many nonwetting regions and voids are formed at the interface because of poor wetting, soldering at 290 °C can form a rigid interface, and tensile strength reaches about 40 MPa.