A few typical delamination patterns of compressed thin films
A few typical delamination patterns of compressed thin films
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压缩薄膜的几种典型分层模式
DOI：
10.1002/pamm.200700349
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发表时间：
2007
期刊：
影响因子：
--
通讯作者：
Gruttmann
中科院分区：
文献类型：
--
作者：
Gruttmann
在本文中，我们考虑在刚性衬底上的压缩平面薄膜。残余压应力，如由温度载荷引起的，是不可逆分层过程的驱动量。一个Reissner-Mindlin壳公式被用作薄膜的模型，因为小的几何缺陷被认为是引发屈曲的原因。对于界面，我们假设存在一个内聚自由能作为开口位移矢量和内部变量的函数。不可逆的分层过程是用指数型的内聚规律来描述的，其中参数取决于模式I， II和III的组合。为了准确地分析脱层过程，我们使用了稳态生长的能量判据。（©2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim）
In this paper we consider compressed flat thin films on rigid substrates. Residual compressive stresses arising e.g. from temperature loading are the driving quantities of the irreversible delamination process. A Reissner–Mindlin shell formulation is used as a model for the thin film, since small geometrical imperfections are considered to initiate buckling. For the interface we postulate the existence of a cohesive free energy as a function of the opening displacement vector and internal variables. The irreversible delamination process is described using a cohesive law of exponential type, where the parameters depend on the combination of the modes I, II and III. In order to analyse the delamination process exactly we use the energy criterion of the steady‐state growth. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)