Adhesion and reactivity in the copper-alumina system : influence of oxygen and silver
Adhesion and reactivity in the copper-alumina system : influence of oxygen and silver
复制标题
铜-氧化铝体系中的附着力和反应性：氧和银的影响
DOI：
10.1163/156856199x00280
复制
发表时间：
1999
影响因子：
2.3
通讯作者：
D. Tréheux
中科院分区：
文献类型：
--
作者：
A. Kara;B. Mbongo;D. Tréheux
强烈的金属-陶瓷键需要热力学粘合，当体系是反应性的时，界面上会形成新的相，或者当体系不是反应性的时，不会形成新的相。铜-氧化铝系统可以是反应性的或非反应性的，这取决于大气和/或铜中的氧含量。确定了非反应/反应转变，对应的氧分压约为4.9×10~(-3)托。对于固态键合，在非反应条件下，随着氧分压趋于这个转换值，键的断裂强度增加。在反应条件下，CuAlO2的生长导致了较高的界面断裂能。对于金属-氧化铝钎焊，为了增强润湿性，在空气中向氧化铝喷洒铜粉，然后使用Ag-28wt%Cu合金进行钎焊。铜-铜合金层中氧的表面活性作用有利于氧化铝在银铜钎料上的润湿，同时也有利于氧化铝在铜基合金表面的附着力。
Strong metal-ceramic bonds require thermodynamic adhesion with the formation of new phases at the interface when the system is reactive, or without the formation of new phases when the system is non-reactive. The copper-alumina system can be reactive or non-reactive depending on the oxygen content in the atmosphere and/or in the copper. The non-reactive/reactive transition was determined and corresponded to an oxygen partial pressure of about 4.9 x 10-3 Torr. For solid-state bonding, in non-reactive conditions, the fracture strength of the bonds increased as the oxygen partial pressure tended towards this transition value. For reactive conditions, the growth of CuAlO2 induced a high interfacial fracture energy. For metal-alumina brazing, to enhance wetting, alumina was sprayed with copper powder in air and subsequently brazed using Ag-28 wt% Cu alloy. The surface-active effect of oxygen present in the Cu-Cu2O deposit favours the wetting of alumina by the AgCu brazing alloy, as well as adhesion, because of...