Analog placement based on hierarchical module clustering
Analog placement based on hierarchical module clustering
复制标题
基于层次模块聚类的模拟布局
DOI：
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发表时间：
2008
期刊：
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通讯作者：
Shyh
中科院分区：
文献类型：
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作者：
Mark Po;Shyh
在模拟版图设计中，减少寄生耦合效应、提高电路性能非常重要。因此，最重要的器件级布局约束是匹配、对称和邻近。然而，许多以前的作品分别处理这些约束，他们都没有提到如何处理不同的约束，同时和层次。在本文中，我们首先给出了一个案例研究，以显示集成这些约束的层次化的方式的需要。然后，我们提出了第一个配方的模拟布局的基础上分层模块聚类。我们的方法可以处理模拟放置与各种约束组，包括匹配，（分层）对称，（分层）接近组。据我们所知，这也是第一次在文献中处理布局规划与聚类约束使用B* 树为基础的表示。基于工业模拟设计的实验结果表明，我们的方法是非常有效的和高效的。
In analog layout design, it is very important to reduce the parasitic coupling effects and improve the circuit performance. Consequently, the most important device-level placement constraints are matching, symmetry, and proximity. However, many previous works deal with these constraints separately, and none of them mention how to handle different constraints simultaneously and hierarchically. In this paper, we first give a case study to show the needs of integrating these constraints in a hierarchical manner. Then, we present the first formulation for analog placement based on hierarchical module clustering. Our approach can handle analog placement with various constraint groups including matching, (hierarchical) symmetry, and (hierarchical) proximity groups. To our best knowledge, this is also the first work in the literature to handle floorplanning with the clustering constraint using the B*-tree based representation. Experimental results based on industrial analog designs show that our approach is very effective and efficient.