Metal films on polymer substrates stretched beyond 50%
Metal films on polymer substrates stretched beyond 50%
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DOI：
10.1063/1.2817234
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发表时间：
2007-11-26
影响因子：
4
通讯作者：
Vlassak, Joost
中科院分区：
文献类型：
--
作者：
Lu, Nanshu;Wang, Xi;Vlassak, Joost
当独立的可塑性变形的金属膜被拉伸时，其通过应变局部化而破裂，并且伸长率小于百分之几。然而，当膜沉积在聚合物衬底上时，应变局部化可能被衬底延迟。本文报道了沉积在Kapton衬底上的Cu膜，并拉伸到衬底的断裂（在50%和60%之间的伸长率）。当在Cu和Kapton之间引入Cr粘附层时，可以发现在Cu中很少有微裂纹，并且测量的电阻与理论预测一致。显微照片表明，应变局部化和脱粘共同发展。(C)2007年，美国物理学会。
When a freestanding plastically deformable metal film is stretched, it ruptures by strain localization, and the elongation is less than a few percent. When the film is deposited on a polymer substrate, however, strain localization may be retarded by the substrate. This paper reports Cu films deposited on Kapton substrates and stretched up to the rupture of the substrates (at an elongation between 50% and 60%). When Cr adhesion layers are introduced between Cu and Kapton, few microcracks in Cu may be found, and the measured electrical resistance agrees with a theoretical prediction. Micrographs show that the strain localization and debonding coevolve. (C) 2007 American Institute of Physics.