Optimization of direct currents to enhance dentine bonding of simplified one-step adhesive
Optimization of direct currents to enhance dentine bonding of simplified one-step adhesive
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优化直流电以增强简化的一步式粘合剂的牙本质粘合
DOI：
10.1111/eos.12140
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发表时间：
2014-08-01
影响因子：
1.9
通讯作者：
Huang, Cui
中科院分区：
文献类型：
--
作者：
Chen, Hongfei;Fu, Dongjie;Huang, Cui
本研究旨在探讨不同直流电强度对Clearfil S-3 Bond粘接牙本质的效果及对人牙髓细胞（HDPCs）活力的影响。对35颗第三磨牙进行切片和研磨，以提供平坦表面。Clearfil S-3 Bond在不同电流条件下作用30 s，形成树脂复合材料。处理样本进行微拉伸粘结强度（mu TBS）测试和纳米泄漏调查，使用扫描电子显微镜。用不同强度的电流刺激前磨牙的原代HDPCs 30 s。然后，使用3-（4，5-二甲基噻唑-2-基）-2，5-二苯基溴化四唑（MTT）测定法检测细胞活力。与所有其他组相比，施加电流强度为50、60、70和90 μ A的试样显示出即时mu TBS的显著增加。使用电辅助电流应用程序制备的键合界面显示界面纳米泄漏减少后，扫描电子显微镜。电流应用，从20到70 μ A，对HDPC的活力没有影响。该研究为今后的临床应用提供了进一步的证据。
The aim of this study was to investigate the effects of different direct current intensities on dentine bonding effectiveness of Clearfil S-3 Bond and on cell viability of human dental pulp cells (HDPCs). Thirty-five-third molars were sectioned and ground to provide flat surfaces. Clearfil S-3 Bond was applied under different current conditions for 30 s and then resin composite was built up. Specimens were processed for microtensile bond strength (mu TBS) testing and for nanoleakage investigation using scanning electron microscopy. Primary HDPCs isolated from premolars were stimulated with different intensities of electric current for 30 s. Then, cell viability was tested using the 3-(4,5-dimethylthiazol-2-yl)-2,5-diphenyl tetrazolium bromide (MTT) assay. Specimens bonded with application of electrical current intensities of 50, 60, 70, and 90 mu A exhibited a significant increase in immediate mu TBS compared with all other groups. Bonded interfaces prepared using electrically assisted current application showed reduced interfacial nanoleakage upon scanning electron microscopy. Electric current application, from 20 to 70 mu A, had no effect on the viability of HDPCs. This study provides further evidence for its future clinical use.