Development and stress analysis of nano cutting force detector

Development and stress analysis of nano cutting force detector
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DOI:
10.2320/jinstmet.68.275
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发表时间:
2004-05-01
影响因子:
--
通讯作者:
Hoshino, Y
Hoshino, Y
中科院分区:
材料科学4区
文献类型:
--
作者:
Asakura, K;Hirohata, Y;Hoshino, Y

文献摘要

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研制了纳米切削力检测仪(NCFD),获得了环氧树脂、大鼠肾脏和40 nm厚铂溅射膜的切削特性。NCFD制作的超薄切片与现成的超薄切片机相比无劣效性。因此,(1)可以测量纳米级有序切片中的切削力。(2)切削力曲线在很大程度上取决于表面的形状。(3)切削力随切削速度的增加而增大。(4)切削力随着厚度的增加而增加,速度不变。(5)在HV 1 -25范围内,切削力随硬度的增加而增加。(6)用半导体应变计型传感器可检测到40 nm厚的层。NCFD的剖切力曲线反映了颤振、超薄切片的状态以及与刀和切割表面的接触。这种新的评估技术是建立与NCFD。
The authors have developed the nano cutting force detector (NCFD), and obtained the cutting characteristics of the epoxy resin, the rat kidney, and the platinum spatter film of 40 nm thick. There was no inferiority for the ultra thin sections made by NCFD when comparing with a ready-made ultramicrotome. Consequently, (1) it was possible to measure the cutting force in the nano level order sectioning. (2) The cutting force profile greatly depends on the shape of the surface. (3) The cutting force increases with increasing of the cutting speed. (4) The cutting force increases with the thickness at a constant speed. (5) The cutting force increases with the hardness in the range of HV1-25. (6) The 40 nn thick layer was detectable by using semiconductor strain gauge type sensor. Sectioning force profile of the NCFD reflected the chatter, the condition of the ultra-thin section, and the contact with knife and cutting surface. This new evaluation technology was established with NCFD.