Microstructural characterisation of spray formed Si-30Al for thermal management applications
Microstructural characterisation of spray formed Si-30Al for thermal management applications
复制标题
DOI：
10.1016/j.scriptamat.2006.02.051
复制
发表时间：
2006-07-01
影响因子：
6
通讯作者：
Grant, PS
中科院分区：
文献类型：
--
作者：
Hogg, SC;Lambourne, A;Grant, PS
本文研究了喷射成形Si-30 wt.%电子封装用铝合金。显微组织由类似于5 μ m的等轴初晶Si晶粒和粗晶富Al相组成，偶尔有类似于10 μ m的等轴富Al晶粒的区域贯穿Si网络，没有层状Al-Si共晶的证据。这种不寻常的微观结构是由于喷射成形过程中和喷射成形后的特殊凝固条件以及大的合金凝固范围而产生的。(c)2006 Acta Materialia Inc.由爱思唯尔有限公司出版。保留所有权利。
This paper presents a study of the microstructure of a spray formed Si-30 wt.%Al alloy used in electronic packaging applications. The microstructure consisted of similar to 5 mu m equiaxed primary Si grains and a coarse grained Al-rich phase with occasional regions of similar to 10 mu m equiaxed Al-rich grains interpenetrating the Si network with no evidence of a lamellar Al-Si eutectic. This unusual microstructure arose because of the particular solidification conditions during and immediately after the spray forming process and the large alloy freezing range. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.