Timing characterisation of 3D-trench silicon sensors
Timing characterisation of 3D-trench silicon sensors
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DOI：
10.1088/1748-0221/15/09/c09054
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发表时间：
2020-09-01
影响因子：
1.3
通讯作者：
Lai, A.
中科院分区：
文献类型：
--
作者：
Lai, A.
未来的跟踪探测器必须是单像素水平的空间和时间测量装置。在未来几十年甚至更久的时间里，对撞机实验中可以预见到极高的相互作用强度。目前，还没有令人满意的技术解决方案，重要的开发计划已经开始朝着这个方向发展。最低系统要求是：能够承受大于10(16)1兆电子伏特中子当量/厘米(2)的影响和一些Grad的辐射剂量；空间分辨率约为10 μ m，时间分辨率低于50 ps。3D硅传感器已经因其极高的辐射硬度和可用于快速响应的固有特性而得到应用。最近，TIMESPOT合作对55 μ m间距的3d沟槽传感器原型进行了测试，该原型专为定时应用而设计，在时间分辨率方面取得了重要成果。实验分别在1030nm脉冲激光束和最小电离粒子束下进行。测试产生的时间分辨率值低于30ps。这些结果表明，截至目前，这些设备可能是唯一能够满足下一代顶点检测器的完整系统要求的设备，可以被视为一个非常有趣的解决方案，有待进一步开发和最终确定。本文将描述所开发的传感器的特性，所进行的测量类型，并讨论所获得的结果。
Future tracking detectors have to be both space and time measuring devices at the single pixel level. This is strongly motivated by the extremely high interaction intensities foreseen at collider experiments of the next couple of decades and possibly beyond. Presently, no satisfactory technical solutions are available and important development programs have started in this direction. Minimal system requirements are: the capability to sustain fluences greater than some 10(16) 1 MeV neutron equivalent/cm(2) and radiation doses of some Grad; space resolutions around 10 mu m and time resolutions below 50 ps. 3D silicon sensors have already found application for their very high radiation hardness and have intrinsic characteristics which can be exploited for fast response. Recently, tests have been made by the TIMESPOT collaboration on 55 mu m pitch 3D-trench sensor prototypes, expressly designed for timing applications, which give important results in terms of time resolution. The tests have been performed both in the laboratory under a 1030 nm pulsed laser beam and under minimum ionizing particle beam. The tests yield values of time resolution below 30 ps. Such results indicate that, as of today, these devices are possibly the only ones capable to satisfy the complete set of system requirements for a vertex detector of the next generation and can be considered as a very interesting solution to be further developed and finalized. This paper will describe the characteristics of the developed sensors, the kind of measurements performed and will discuss the results obtained.