Pressure-sensitive adhesive properties of wheat flour dough and the influence of temperature, separation rate, and moisture content
Pressure-sensitive adhesive properties of wheat flour dough and the influence of temperature, separation rate, and moisture content
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小麦粉面团压敏粘合特性及温度、分离率、含水量的影响
DOI：
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发表时间：
1994
期刊：
影响因子：
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通讯作者：
L. Slade
中科院分区：
文献类型：
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作者：
S. S. Heddleson;D. D. Hamann;D. Lineback;L. Slade
用缩减变量法将面团的探针粘性试验数据转换成一系列主曲线。这说明了增加温度、增加水分含量和降低分离速率对粘附行为的等效影响。在25-30 ° C（含水量43%）时发生粘合-内聚失效转变。这种转变发生在压敏粘合剂的Tg以上50-70 ° C，并且与粘弹性行为从橡胶态（存在缠结网络）到流动态（缠结网络由于滑移而消失）的转变有关。低分子量增塑剂（如水）将橡胶流动状态转变的位置转移到较低的温度和较快的速率。因此，随着面团水分含量的增加，粘合剂-内聚失效转变向较低温度和较快分离速率转变。加工者可以通过改变配方或加工速率-温度条件以有利于失效过渡区的粘合剂侧来防止内聚失效，从而防止残留物在设备上积聚
Using the method of reduced variables, probe tack test data on wheat flour-water doughs was shifted into a series of master curves. This illustrated the equivalent influence of increasing temperature, increasing moisture content, and decreasing separation rate on adhesive behavior. An adhesive-cohesive failure transition occurred at 25-30 o C (43% moisture content). This transition occurs 50-70 o C above the T g of a pressure-sensitive adhesive and is associated with a shift in viscoelastic behavior from the rubbery state (entanglement network present) to the flow state (entanglement network disappears due to slippage). Low molecular weight plasticizers (such as water) shift the location of the rubbery-flow state transition to lower temperatures and faster rates. Thus, as the moisture content of the dough increased, the adhesive-cohesive failure transition shifted to lower temperatures and faster separation rates. Processors could prevent cohesive failure, and thus a residue-buildup on equipment, by changing either the formulations or the processing rate-temperature conditions to favor the adhesive side of the failure transition zone