Analysis and experimental verification of digital substrate noise generation for epi-type substrates
Analysis and experimental verification of digital substrate noise generation for epi-type substrates
复制标题
外延型衬底数字衬底噪声产生分析与实验验证
DOI：
10.1109/4.848209
复制
发表时间：
2000
影响因子：
5.4
通讯作者：
I. Bolsens
中科院分区：
文献类型：
--
作者：
M. V. Heijningen;J. Compiet;P. Wambacq;S. Donnay;M. Engels;I. Bolsens
混合信号 IC 中的基板耦合会导致模拟电路的性能严重下降。因此需要精确的模拟来研究基板噪声的产生、传播和影响。最近的研究仅限于所生成的基底噪声的时域行为以及来自单个噪声源的噪声注入。本文重点关注数字电路产生的基板噪声以及该噪声的频谱内容。为了模拟噪声的产生，使用了重掺杂外延型衬底的 SPICE 衬底模型。该模型的准确性已通过使用宽带、连续时间基底噪声传感器测量基底噪声得到验证，该传感器可以精确测量基底噪声的频谱内容。在时域和频域中分析了数字电路的基底噪声产生，并论证了不同基底噪声耦合机制的影响。结果表明，会产生高达 20 mV 的衬底噪声电压，并且在高达 1 GHz 的频带中，会在时钟和重复频率的倍数处产生噪声峰值。这些噪声信号将严重恶化集成前端中使用的小信号模拟放大器的性能。
Substrate coupling in mixed-signal IC's can cause important performance degradation of the analog circuits. Accurate simulation is therefore needed to investigate the generation, propagation, and impact of substrate noise. Recent studies were limited to the time-domain behavior of generated substrate noise and to noise injection from a single noise source. This paper focuses on substrate noise generation by digital circuits and on the spectral content of this noise. To simulate the noise generation, a SPICE substrate model for heavily doped epi-type substrates has been used. The accuracy of this model has been verified with measurements of substrate noise, using a wide-band, continuous-time substrate noise sensor, which allows accurate measurement of the spectral content of substrate noise. The substrate noise generation of digital circuits is analyzed, both in the time and frequency domain, and the influence of the different substrate noise coupling mechanisms is demonstrated. It is shown that substrate noise voltages up to 20 mV are generated and that, in the frequency band up to 1 GHz, noise peaks are generated at multiples of the clock and repetition frequency. These noise signals will strongly deteriorate the behavior of small signal analog amplifiers, as used in integrated front-ends.