Finite difference modeling of multiple planes in packages
Finite difference modeling of multiple planes in packages
复制标题
封装中多个平面的有限差分建模
DOI：
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发表时间：
2006
期刊：
影响因子：
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通讯作者：
Yoshitaka Toyota
中科院分区：
文献类型：
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作者：
A. E. Engin;Madhavan Swaminathan;Yoshitaka Toyota
电子封装中的电源/接地层可能是噪声耦合的主要因素。噪声不仅在两个平面之间的横向方向上存在耦合，而且通过孔和通孔从一个平面对垂直地耦合到另一个平面对。由于电源/接地层的尺寸很大，很难使用全波模拟器对其进行分析。众所周知，亥姆霍兹方程的有限差分解提供了具有可比精度的更快的方法。本文提出了基于有限差分法的单平面对的新电路模型：T模型和X模型。提出了一种多平面对通过孔缝耦合的建模方法
Power/ground planes in electronic packaging can be a major factor for noise coupling. There can be noise coupling not only in the transversal direction between two planes, but also vertically from one plane pair to another through the apertures and via holes. Due to the large size of the power/ground planes, it is difficult to analyze them using full-wave simulators. It is known that the finite difference solution of the Helmholtz equation provides a faster approach with a comparable accuracy. This paper presents new circuit models for a single plane pair based on the finite difference method: T- and X-models. It also presents a modeling approach for multiple plane pairs that are coupled through apertures