On the wear mechanism of thin nickel film during AFM-based scratching process using molecular dynamics
On the wear mechanism of thin nickel film during AFM-based scratching process using molecular dynamics
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DOI：
10.1007/s12206-011-0606-6
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发表时间：
2011-09
影响因子：
1.6
通讯作者：
H. M. Khan;Sung-Gaun Kim
中科院分区：
文献类型：
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作者：
H. M. Khan;Sung-Gaun Kim
我们报告了一项研究，单晶镍薄膜使用原子力显微镜（AFM）为基础的划痕过程，以了解相关的磨损机制。对于纳米级加工，更好地理解磨料磨损机理是一个先决条件。一个三维分子动力学（MD）的研究已经进行，我们已经使用了一个新的参数磨损量来区分不同的磨损区。已经提出了减少区域的数量，以了解纳米划痕过程中的磨损机制。中心对称参数也被用来验证这一发现。
We report a study on monocrystalline nickel thin films using the atomic force microscope (AFM) based scratching process to understand the associated wear mechanism. As for the nano level fabrication, better understanding of abrasive wear mechanism is a prerequisite. A three-dimensional molecular dynamics (MD) study has been performed and we have used a new parameter wear volume to distinguish between different wear zones. A reduced number of zones have been proposed to understand the wear mechanism during nanoscratching process. Also, centrosymmetry parameter has been used to validate the findings.