Studies on drilling processes of intermetallic compounds
Studies on drilling processes of intermetallic compounds
复制标题
金属间化合物钻削工艺研究
DOI：
10.1016/j.jmatprotec.2008.10.014
复制
发表时间：
2009-05
影响因子：
6.3
通讯作者：
Huang, L.X.
中科院分区：
文献类型：
--
作者：
Liu, L.;Shao, H.;Huang, L.X.
金属间化合物在高温下具有高比强度、良好的抗蠕变性能和优异的抗氧化和耐腐蚀性能。这些良好的力学性能使金属间化合物成为很有前景的工业结构材料。Ni3Al和Fe3Al是两种典型的金属间化合物。重点研究了PVD TiAlN涂层硬质合金刀具在Ni3Al和Fe3Al钻孔加工中的切削性能和刀具磨损机理。研究了切削速度对刀具磨损和加工表面粗糙度的影响。利用扫描电子显微镜（SEM）和EDX分析分析了刀具磨损机理。采用扫描电镜对切屑进行了分析，并用表面粗糙度测量仪对加工表面进行了检测。Ni3Al的刀具寿命比Fe3Al的刀具寿命短。在切削速度为29m/min时，Fe3Al在切削刃上形成堆积边（BUE）， Ni3Al在切削刃上没有形成BUE。
Intermetallic compounds have high-specific strength, good creep resistance and excellent oxidation and corrosion resistance at high temperatures. Those good mechanical properties make intermetallic compounds very promising structure materials in industries. Ni3Al and Fe3Al are two typical intermetallic compounds. This paper focuses on machinability and tool wear mechanism of PVD TiAlN coated cemented carbide tool in drilling of Ni3Al and Fe3Al. The influences of cutting speeds on tool wear and machined surface roughness were investigated. The tool wear mechanism was analyzed using scanning electron microscopy (SEM) and EDX analysis. Chips were analyzed by SEM and the machined surfaces were examined by surface roughness measurement instrument. Tool life when drilling of Ni3Al is shorter than that of Fe3Al. The built-up-edge (BUE) could be formed on the cutting edge in drilling of Fe3Al, and no BUE was observed of Ni3Al at the cutting speed of 29m/min.
登录
查看更多内容
影响因子：
1.8
作者：
U. Prakash;R. Buckley;H. Jones;C. M. Sellars
通讯作者：
U. Prakash;R. Buckley;H. Jones;C. M. Sellars
DOI：
10.1016/s0921-5093(02)00585-3
发表时间：
2003-04
影响因子：
6.4
作者：
R. Sundar;D. Sastry;Y. Prasad
通讯作者：
R. Sundar;D. Sastry;Y. Prasad
影响因子：
5
作者：
Jun Yang;P. La;Wei-min Liu;Q. Xue
通讯作者：
Jun Yang;P. La;Wei-min Liu;Q. Xue
影响因子：
5
作者：
D. Alman;J. Hawk;J. Tylczak;C. P. Dogan;Rick D. Wilson
通讯作者：
D. Alman;J. Hawk;J. Tylczak;C. P. Dogan;Rick D. Wilson
影响因子：
2.6
作者：
C. Liu;K. Kumar
通讯作者：
C. Liu;K. Kumar