Application of Novel Ultrasonic Cleaning Equipment That Uses the Waveguide Mode for the Single-Wafer Cleaning Process
Application of Novel Ultrasonic Cleaning Equipment That Uses the Waveguide Mode for the Single-Wafer Cleaning Process
复制标题
新型波导模式超声波清洗设备在单晶圆清洗过程中的应用
DOI：
10.1143/jjap.50.05ec10
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发表时间：
2011
影响因子：
1.5
通讯作者：
Y. Koike
中科院分区：
文献类型：
--
作者：
Kazunari Suzuki;Yasuhiro Imazeki;Ki Han;S. Okano;J. Soejima;Y. Koike
我们演示了使用波导型超声波设备清洗单晶片。波导以兰姆波的形式振动，900千赫的超声波在介音速频率范围内从波导侧辐射。由于波导端的超声波吸收到水中，波导在波导侧和晶片表面之间产生行波场。对于行波场，获得的粒子去除效率(PRE)与传统间歇式设备相当，并抑制了导致半导体器件图案缺陷的空化气泡坍塌。用涂有光致抗蚀剂薄膜的硅片观察到空泡的崩塌，并用电荷耦合器件(CCD)摄像系统捕捉到了声致发光的图像。
We demonstrate single-wafer cleaning using waveguide-type ultrasonic equipment. The waveguide vibrates as a Lamb wave, and ultrasonic waves of 900 kHz, which is within the megasonic frequency range, radiate from the waveguide side. The waveguide creates a traveling wave field between the waveguide side and wafer surface owing to ultrasonic absorption into the water at the waveguide end. For a traveling wave field, the obtained particle removal efficiency (PRE) was as good as that obtained with conventional batch-type equipment, and cavitation bubble collapse, which induces pattern defects on semiconductor devices, was suppressed. Cavitation bubble collapse was observed using wafers coated with photoresist film, and images of sonoluminescence were captured with a charge coupled device (CCD) camera system.