Non-destructive evaluation of YIG films by ferromagnetic resonance
Non-destructive evaluation of YIG films by ferromagnetic resonance
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DOI：
10.1109/20.42344
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发表时间：
1989-03
期刊：
影响因子：
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通讯作者：
J.D. Adas;S. Talisa;P.R. Estage;M. Daniel;J. Kerestes
中科院分区：
文献类型：
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作者：
J.D. Adas;S. Talisa;P.R. Estage;M. Daniel;J. Kerestes
提出了一种通过测量硅片局部区域的铁磁共振（FMR）线宽来评价厚YIG薄膜的新技术。该技术是基于在偏置磁场下在薄膜的小区域内激发静磁波（MSW）共振。井是由靠近薄膜表面的软铁板上的一个小孔形成的。msw是由波导侧面的一个孔发出的电磁场激发的。该技术已用于厚度约为100 μ m的薄膜上，产生的FMR线宽与从薄膜上蚀刻或切割的小型谐振器所获得的线宽相当。这些全晶圆测量不仅无损且操作简单，而且还允许探测薄膜的不同区域。>
A novel technique for evaluating thick YIG films by measuring the ferromagnetic resonance (FMR) linewidth on a localized area of the wafer is presented. The technique is based on the excitation of magnetostatic wave (MSW) resonance in a small area of the film under a bias magnetic field well. The well is created by a small hole in a soft-iron plate in close proximity to the film surface. The MSWs are excited by the electromagnetic fields emanating from a hole on the side of a waveguide. The technique has been used on films with thicknesses of around 100 mu m, yielding FMR linewidths comparable to those obtained with small resonators etched or cut from the film. These full-wafer measurements are not only nondestructive and simple to perform, but also allow probing of different areas of the film. >