Thermal Decomposition of Printed Circuit Board in the Presence of Zinc Oxide under Inert and Oxidative Atmosphere: Emission Behavior of Inorganic Brominated Compounds
Thermal Decomposition of Printed Circuit Board in the Presence of Zinc Oxide under Inert and Oxidative Atmosphere: Emission Behavior of Inorganic Brominated Compounds
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DOI：
10.4236/eng.2018.109044
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发表时间：
2018-08
期刊：
影响因子：
12.8
通讯作者：
O. Terakado;S. Kuzuhara;H. Takagi;M. Hirasawa
中科院分区：
文献类型：
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作者：
O. Terakado;S. Kuzuhara;H. Takagi;M. Hirasawa
为了控制有害溴化化合物的排放，对含有溴化阻燃剂的 FR-4 型印刷电路板、PCB 在惰性和氧化气氛中的热降解进行了研究。气氛中氧气的存在导致溴化氢（热处理中主要溴化化合物之一）的产率降低，并导致溴和次溴酸的形成增加。有意将氧化锌添加到 PCB 粉末样品中，导致 Br 以溴化锌的形式固定。与纯 PCB 相比，它还促进了溴化化合物的释放。因此，添加氧化物对于溴固定和 PCB 热处理动力学以及金属回收是有益的。
Thermal degradation of a FR-4 type printed circuit board, PCB, containing brominated flame retardant has been studied both in inert and oxidative atmosphere for the emission control of harmful brominated compounds. The presence of oxygen in atmosphere resulted in the reduction of the yield of hydrogen bromide, one of the major brominated compounds in thermal treatment, and in the enhancement of the formation of bromine and hypobromous acid. The intentional addition of zinc oxide to the PCB powder sample gave rise to the fixation of Br as zinc bromide. It also resulted in the promotion of the release of brominated compounds in comparison to the case of pure PCB. Thus, the addition of the oxide can be a benefit with respect to the bromine fixation and the kinetics of thermal treatment of PCB as well as metal recovery.