Three-dimensional microdrilling of glass by multiphoton process and chemical etching
Three-dimensional microdrilling of glass by multiphoton process and chemical etching
复制标题
DOI：
10.1143/jjap.38.l1146
复制
发表时间：
1999-10-01
期刊：
影响因子：
--
通讯作者：
Yoko, T
中科院分区：
文献类型：
--
作者：
Kondo, Y;Qiu, J;Yoko, T
我们通过非共振飞秒激光脉冲的多光子过程和随后的化学刻蚀，展示了玻璃的三维微钻孔。我们使用的是对波长小于320纳米的连续紫外光敏感的可光加工玻璃。非共振飞秒激光脉冲经400 nm聚焦照射和后续热处理后，得到了Li(2O)O晶体。与基质玻璃相比，在稀氢氟酸中更易溶解的SiO(2)在玻璃样品中的激光聚焦区域析出。微晶蚀刻后，在玻璃样品中形成三维孔洞。我们在玻璃样品上生产直孔和Y分叉孔。该技术可应用于微光学、微电子学和微化学等领域。
We demonstrate the three-dimensional microdrilling of glass by the multiphoton process with nonresonant femtosecond laser pulses and by the subsequent chemical etching. We use photomachinable glass which is sensitive to cw UV light of a wavelength shorter than 320 nm. After the focused irradiation of nonresonant femtosecond laser pulses at 400 nm and subsequent heat treatment, crystallites of Li(2)O . SiO(2), which are more soluble in dilute hydrofluoric acid than matrix glass, precipitate in the focused area of the laser within the glass sample. After etching the crystallites, three-dimensional holes are formed in the glass sample. We produce straight and Y-branched holes in the glass sample. This technique can be applied to the fields of microoptics, microelectronics and microchemicals.