Methods to reduce radiation from split ground planes in RF and mixed signal packaging structures
Methods to reduce radiation from split ground planes in RF and mixed signal packaging structures
复制标题
减少射频和混合信号封装结构中分离接地层辐射的方法
DOI：
10.1109/tadvp.2002.805997
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发表时间：
2002
期刊：
影响因子：
--
通讯作者：
J. Prince
中科院分区：
文献类型：
--
作者：
T. E. Moran;K. Virga;G. Aguirre;J. Prince
有时在射频和混合信号封装中使用分离接地层，以便将射频和模拟电路与数字电路隔离。当信号走线经过接地层的槽时，封装环境中可能会出现不需要的辐射。本文检查和研究了消除信号耦合到分离接地层结构中的方法，并评估了这种减少的耦合对封装环境中信号完整性的影响。减少耦合到槽中的能量的建议方法是使用射频扼流圈或波纹来改变槽的形状。
Split ground planes are sometimes used in RF and mixed signal packages in order to isolate the RF and analog circuits from the digital circuits. Undesired radiation in a packaging environment may occur when a signal trace is routed over a slot in the ground plane. This paper examines and investigates ways to eliminate signal coupling into split ground plane structures and assesses the impact of this reduced coupling on signal integrity in a packaging environment. Suggested methods to reduce coupling of energy into the slot are to alter the shape of the slot with RF chokes or corrugations.
影响因子：
4.1
作者：
BERENGER, JP
通讯作者：
BERENGER, JP