Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature
Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature
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DOI：
10.1108/ssmt-04-2022-0027
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发表时间：
2022-10
期刊：
影响因子：
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通讯作者：
Gui-Sheng Gan;Shi-Qi Chen;Liujie Jiang;Qianzhu Xu;Tian Huang;Dayong Cheng;Xin Liu
中科院分区：
文献类型：
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作者：
Gui-Sheng Gan;Shi-Qi Chen;Liujie Jiang;Qianzhu Xu;Tian Huang;Dayong Cheng;Xin Liu
目的研究热时效温度对铜/铝接头性能的影响。设计/方法/方法在200℃超声辅助下，将粒度为25~38µm的SAC0307与1µm的锌颗粒混合填充，成功地实现了铜/铝的微连接，并研究了时效温度对不同时效时间的铜/铝接头性能的影响。结果表明，铜界面金属间化合物(IMCs)具有相同的成分，并具有两层结构，Cu5Zn8靠近铜衬底，CuZn5靠近焊料。随着时效时间的延长，CuZn5逐渐转变为Cu5Zn8，CuZn5层厚度逐渐减小，直至CuZn5完全消失。在Al界面处有一种锡-锌固溶体，且Cu/Al接头的Al界面成分不随温度变化而变化。随着时效温度的升高和时效时间的延长，接头铜界面处IMC厚度继续增加，接头剪切强度下降。当时效温度为15 0℃，时效2 4h时，接头界面金属间化合物厚度增加371.8%，剪切强度降低83.2%，随着时效温度的升高，接头的断裂方式由焊球与锌颗粒之间的断裂转变为锌颗粒之间的断裂。原始/值随着时效温度的升高，相同时效时间下，Cu/SACZ/Al接头的剪切强度下降，150℃保温24小时的接头剪切强度比时效前降低了83.2%。
Purpose This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Al joints. Design/methodology/approach A new method in which 1 µm Zn-particles and SAC0307 with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved the micro-joining of Cu/Al under ultrasonic-assisted at 200°C, and then, the effect of aging temperature on the properties of Cu/Al joints at different aging times was researched. Findings The results showed that the Cu interface intermetallic compounds (IMCs) had the same composition and had two layers with Cu5Zn8 near the Cu substrate and CuZn5 near the solder. As the aging time increased, CuZn5 gradually transformed to Cu5Zn8, and the thickness of the CuZn5 layer gradually decreased until CuZn5 disappeared completely. There was a Sn–Zn solid solution at the Al interface, and the composition of the Al interface of the Cu/Al joints did not change with changing temperature. The IMC thickness at the Cu interface of the joints continued to increase, and the shear strength of the Cu/Al joints decreased with increasing aging temperature and time. Compared with the as-received samples, the IMC thickness of the Cu interface of joints increased by 371.8% and the shear strength of the Cu/Al joints was reduced by 83.2% when the joints were aged at 150°C for 24 h. With an increase in aging temperature, the fracture mode of the Cu/Al joints changed from being between solder balls and Zn particles to between Zn particles. Originality/value With increasing aging temperature, the shear strengths of the Cu/SACZ/Al joints decreased at the same aging time, the shear strength of Cu/SACZ/Al joints at 150°C for 24h decreased by 83.2% compared with that of the as-received joints.