One step thin-film PV interconnection process using laser and inkjet
One step thin-film PV interconnection process using laser and inkjet
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使用激光和喷墨的一步式薄膜光伏互连工艺
DOI：
10.1109/pvsc.2013.6745181
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发表时间：
2013
期刊：
影响因子：
--
通讯作者：
J. Shephard
中科院分区：
文献类型：
--
作者：
M. Crozier;A. Brunton;A. Abbas;J. Bowers;P. Kamiński;J. Walls;J. Shephard
单片串联互连是薄膜光伏的一个关键优势。标准方法是交替层沉积和激光划片。在这里，M-Solv专利的一步互连（OSI）工艺被引入作为传统的全激光互连的替代方案。OSI在所有沉积完成后通过一个步骤将TF-PV模块互连起来，具有相当大的优势：减少资本支出;更好的过程控制;更少的真空/空气界面，减少生产线占地面积和更快的面板运输。OSI采用激光划线和喷墨打印功能材料的组合。在CdTe上制作了具有良好电学性能的OSI微型组件。虽然这里的重点是CdTe，但OSI适用于所有薄膜技术。所提出的激光和喷墨工艺完全可扩展用于工业生产。
Monolithic series interconnection is a key advantage of thin-film PV. The standard approach is to alternate layer deposition and laser scribing. Here the M-Solv patented One Step Interconnect (OSI) process is introduced as an alternative to the conventional all laser interconnect. OSI interconnects TF-PV modules in a single step after all deposition is complete with considerable advantages: reduced capital expenditure; better process control; less vacuum/air interfaces, reduced line footprint and faster panel transit. OSI employs a combination of laser scribing and inkjet printing of functional materials. OSI mini-modules have been fabricated on CdTe with good electrical performance. Although the focus here has been CdTe, OSI is applicable to all thin-film technologies. The laser and inkjet processes presented are fully scalable for industrial production.