Elastomeric Syntactic Foams for Stress Relief of Electronic Components
Elastomeric Syntactic Foams for Stress Relief of Electronic Components
复制标题
用于电子元件应力消除的弹性复合泡沫
DOI：
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发表时间：
1978
期刊：
影响因子：
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通讯作者：
P. Rand
中科院分区：
文献类型：
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作者：
P. Rand
弹性复合泡沫塑料已被开发用作封装电子组件中电子元件上的应力消除涂层。与玻璃和酚醛树脂制成的微泡混合的聚硫化物、有机硅和聚氨酯弹性体都已用于配制各种应用的复合泡沫塑料。这些泡沫用于最大限度地减少电子组件中元件和密封剂之间热膨胀差异引起的应力。压缩应力应变曲线已用于确定温度、配方和测试配置对这些泡沫的影响。微泡-树脂混合物具有足够的流动性，可以在固化前抽空和倾倒。这些泡沫可以使用低压注射成型技术或简单地刷涂或浸渍来施加。开发了评估这些弹性复合泡沫片材所必需的测试技术。这些弹性体复合泡沫已被证明是易于配制的多功能材料，已在许多应用中用于缓解因热膨胀差异引起的应力。
Elastomeric syntactic foams have been developed for use as stress relief coatings on electronic components in encapsulated electronic assemblies. Polysulfide, silicone, and polyurethane elastomers blended with microbubbles made from glass and phenolic resins have all been used to formulate syntactic foams for various applications. These foams are used to minimize the stresses caused by differential thermal expansion between the component and the encapsulant in electronic assemblies. Compressive stress strain curves have been used to determine the effects of temperature, formulation, and test configuration on these foams. The microbubble-resin blends are fluid enough to evacuate and pour before curing. These foams may be applied using a low-pressure injection molding technique or by simply brushing or dipping. Testing techniques, necessary to evaluate these sheets of elastomeric syntactic foams, were developed. These elastomeric syntactic foams have proven to be easily formulated, versatile materials that have been used in many applications to relieve the stresses caused by differential thermal expansion.