Progress in Cooling Nanoelectronic Devices to Ultra-Low Temperatures.
Progress in Cooling Nanoelectronic Devices to Ultra-Low Temperatures.
复制标题
冷却纳米电子设备的进展到超低温度。
DOI:
10.1007/s10909-020-02472-9
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发表时间:
2020
影响因子:
2
通讯作者:
Haley RP
中科院分区:
文献类型:
--
作者:
Jones AT;Scheller CP;Prance JR;Kalyoncu YB;Zumbühl DM;Haley RP
Here we review recent progress in cooling micro-/nanoelectronic devices significantly below 10 mK. A number of groups worldwide are working to produce sub-millikelvin on-chip electron temperatures, motivated by the possibility of observing new physical effects and improving the performance of quantum technologies, sensors and metrological standards. The challenge is a longstanding one, with the lowest reported on-chip electron temperature having remained around 4 mK for more than 15 years. This is despite the fact that microkelvin temperatures have been accessible in bulk materials since the mid-twentieth century. In this review, we describe progress made in the last 5 years using new cooling techniques. Developments have been driven by improvements in the understanding of nanoscale physics, material properties and heat flow in electronic devices at ultralow temperatures and have involved collaboration between universities and institutes, physicists and engineers. We hope that this review will serve as a summary of the current state of the art and provide a roadmap for future developments. We focus on techniques that have shown, in experiment, the potential to reach sub-millikelvin electron temperatures. In particular, we focus on on-chip demagnetisation refrigeration. Multiple groups have used this technique to reach temperatures around 1 mK, with a current lowest temperature below 0.5 mK.
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影响因子:
16.6
作者:
Camenzind LC;Yu L;Stano P;Zimmerman JD;Gossard AC;Loss D;Zumbühl DM
通讯作者:
Zumbühl DM
影响因子:
16.6
作者:
Bradley DI;George RE;Gunnarsson D;Haley RP;Heikkinen H;Pashkin YA;Penttilä J;Prance JR;Prunnila M;Roschier L;Sarsby M
通讯作者:
Sarsby M
影响因子:
3.7
作者:
Alicea, Jason
通讯作者:
Alicea, Jason
影响因子:
1.6
作者:
Bluhm, Hendrik;Moler, Kathryn A.
通讯作者:
Moler, Kathryn A.
影响因子:
2
作者:
BUNKOV, YM;GUENAULT, AM;WARD, MG
通讯作者:
WARD, MG