Thermal conductivity enhancement of PEG/SiO2 composite PCM by in situ Cu doping
Thermal conductivity enhancement of PEG/SiO2 composite PCM by in situ Cu doping
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原位Cu掺杂增强PEG/SiO2复合PCM的热导率
DOI：
10.1016/j.solmat.2012.06.012
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发表时间：
2012-10-01
影响因子：
6.9
通讯作者：
Zhang, Shufen
中科院分区：
文献类型：
--
作者：
Tang, Bingtao;Qiu, Meige;Zhang, Shufen
为了提高聚乙二醇（PEG）/SiO2杂化形稳相变材料（PCM）在充放热过程中的能量利用效率，采用超声辅助溶胶-凝胶法原位化学还原CuSO 4，实现原位Cu掺杂。该方法制备条件温和，是开发新型高导热复合形稳相变材料的重要途径。XPS结果表明，PEG 6000/SiO2 PCM中铜的价态主要为零。FTIR分析表明，Cu、PEG 6000和SiO2之间没有形成新的化学键。通过DSC和TGA分析证实了复合相变材料的热性能和热稳定性。Cu/PEG/SiO2相变材料的相变焓高达110 J/g，导热系数为0.414 W/（m K），比纯PEG提高了38.1%。Cu/PEG/SiO2杂化材料具有优异的热稳定性和良好的形状稳定性。皇冠版权所有（c）2012由爱思唯尔B. V.出版保留所有权利。
In order to improve the energy utilization efficiency during heat charging and discharging processes, thermal conductivity enhancement of polyethylene glycol (PEG)/SiO2 hybrid form-stable phase change material (PCM) was achieved by in situ Cu doping via in situ chemical reduction of CuSO4 through ultrasound-assisted sol-gel process. This method would be an important approach to develop novel hybrid form-stable PCM with high thermal conductivity due to the mild preparation conditions. The XPS result of this material showed that the valence state of copper in PEG6000/SiO2 PCM was mainly zero. The FTIR demonstrated that there was no new chemical bond between Cu, PEG6000 and SiO2. The thermal properties and thermal stability of the composite PCM were confirmed using DSC and TGA analyses. The phase change enthalpy of Cu/PEG/SiO2 PCM reached up to 110 J/g, and the thermal conductivity was 0.414 W/(m K) for 2.1 wt% Cu in PEG/SiO2, which was enhanced by 38.1% compared to pure PEG. The Cu/PEG/SiO2 hybrid material had excellent thermal stability and good form-stable performance. Crown Copyright (c) 2012 Published by Elsevier B.V. All rights reserved.