Effect of homogenization treatment on microstructure and properties for Cu–Fe–Ag in situ composites
Effect of homogenization treatment on microstructure and properties for Cu–Fe–Ag in situ composites
复制标题
DOI：
10.1016/j.msea.2011.09.047
复制
发表时间：
2011-11
期刊：
影响因子：
6.4
通讯作者：
Zhixiong Xie;Haiyan Gao;Jun Wang;Bao-de Sun
中科院分区：
文献类型：
--
作者：
Zhixiong Xie;Haiyan Gao;Jun Wang;Bao-de Sun
研究了均匀化处理对Cu-8 Fe-0.1Ag和Cu-8 Fe-0.5Ag（wt.%，下文类似地）研究原位复合材料。通过感应熔炼、铸造、均匀化处理和冷加工制备了复合材料。观察了复合材料的微观结构，并分别测定了复合材料的拉伸强度和电导率。结果表明，均匀化处理细化了Cu基体中的初生Fe枝晶，促进了二次Fe颗粒的析出，提高了复合材料的强度和电导率。在随后的冷变形过程中，与铸态相比，均质化的合金容易被拉伸成细小且连续的非晶复合材料，由于增加的界面密度而导致高强度。
The effects of homogenization treatment on the microstructure and properties of Cu–8Fe–0.1Ag and Cu–8Fe–0.5Ag (wt.%, similarly hereinafter) in situ composites were investigated. The composites were prepared by inductive melting, casting, homogenization treatment and subsequent cold work. Microstructures of the composites were observed and the tensile strength plus electrical conductivity was measured respectively. The results show that the prior homogenization treatment results in refinement of the primary Fe dendrites in Cu matrix and promotes the precipitation of the secondary Fe particles from the Cu matrix, which leads to increase in the strength and conductivity of the composites. During the following cold deformation, the homogenized alloys are readily elongated into fine and continuous filamentary composites compared with the as-cast, leading to high strength due to the increased interface density.