Modeling of interfacial void closure and prediction of bonding time in solid-state diffusion bonding
Modeling of interfacial void closure and prediction of bonding time in solid-state diffusion bonding
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DOI：
10.1016/j.jmatprotec.2023.118267
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发表时间：
2023-12
影响因子：
6.3
通讯作者：
Y. Peng;Z.X. Li;W. Guo;J. Xiong;J.L. Li
中科院分区：
文献类型：
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作者：
Y. Peng;Z.X. Li;W. Guo;J. Xiong;J.L. Li
采用基于变形机理的有限元分析和基于扩散机理的数值分析相耦合的方法，建立了扩散连接过程中孔洞闭合的分析模型。最大应力集中在与键合界面接触的微凸体尖端。随着键合温度和键合压力的升高，应力集中区从微凸区的尖端向空颈区移动。应力分布集中在微凸区域（空颈区域）的尖端上，与所施加的键合压力的方向相反。利用该模型，根据孔洞闭合的演化过程定义了特征时间参数（时间常数）tc。此时，预测粘结比为（1 - 1/e）乘以正常极限粘结比和1/e乘以正常初始粘结比之和。此外，通过耦合所需键合比和变形速率的限制，建立了键合时间预测模型，该模型可用于预测操作窗口内的键合时间。绘制了时间常数（tc/min）和标称极限粘结比（fult/%）的等值线图，以进行直观表示。
An analytical model of the void closure during diffusion bonding was established by coupling finite element analysis (FEA) based on the deformation mechanism and numerical analysis based on the diffusion mechanism. The maximum stress was concentrated at the tip of the microconvex in contact with the bonding interface. With increasing bonding temperature and pressure, the stress concentration region moved from the tip of the microconvex region to the void neck region. The stress distribution was concentrated on the tip of the microconvex region (void neck region) to the opposite direction of the applied bonding pressure. Using the model, the characteristic time parameter (time constant)tcwas defined based on the evolution of the void closure. At this moment, the predicted bonded ratio was the sum of (1 −1/e) times the normal limit bonded ratio and 1/e times the normal initial bonded ratio. Furthermore, a model for predicting the bonding time was established by coupling the required bonded ratio and the limitation of the deformation rate, the model can be used to predict the bonding time within the operation window. Contour maps of time constant (tc/min) and the nominal limit bonded ratio (fult/%) were constructed for visual representation.