Bending properties of solder joint of YBCO coated conductors by etching copper stabilizer
Bending properties of solder joint of YBCO coated conductors by etching copper stabilizer
复制标题
铜稳定剂蚀刻YBCO涂层导体焊点的弯曲性能
DOI：
10.1016/j.physc.2019.03.019
复制
发表时间：
2019
影响因子：
1.7
通讯作者：
Ding Fazhu
中科院分区：
文献类型：
--
作者：
Huang Daxing;Gu Hongwei;Zhang Hua;Dong Zebin;Shang Hongjing;Xu Wenjuan;Li Taiguang;Xie Bowei;Ding Fazhu
