Heterogeneously Integrated Quantum Chip Interposer Packaging
Heterogeneously Integrated Quantum Chip Interposer Packaging
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DOI：
10.1109/ectc51906.2022.00294
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发表时间：
2022-05
期刊：
影响因子：
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通讯作者：
Ramesh Kudalippalliyalil;S. Chandran;Akhilesh R. Jaiswal;Kang L. Wang;A. Jacob
中科院分区：
文献类型：
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作者：
Ramesh Kudalippalliyalil;S. Chandran;Akhilesh R. Jaiswal;Kang L. Wang;A. Jacob
量子计算机为特定的计算密集型经典问题提供了更快的解决方案。然而，构建一个容错的量子计算机体系结构是具有挑战性的，需要在保持量子相干的同时，将几个量子比特与优化的信号路由集成在一起。由于各种元素之间的材料和热力学失配，在平面单片器件体系结构中实现这种具有不同功能组件的量子计算机是具有挑战性的。此外，它需要复杂的控制和布线，导致寄生模式和降低的量子比特一致性。因此，一个可扩展的内插器架构对于合并和互连复杂芯片内的不同功能，同时保持量子比特一致性是必不可少的。因此，异质集成是扩大量子比特技术规模的最佳解决方案。我们提出了一种异质集成的量子芯片光电子内插器作为高密度可扩展量子比特体系结构的解决方案。我们的技术可大批量制造，并为片上、芯片到芯片和低温到外部世界互连提供新颖的光学I/O解决方案。
Quantum computers provide faster solutions to specific compute-intensive classical problems. However, building a fault-tolerant quantum computer architecture is challenging and demands integrating several qubits with optimized signal routing while maintaining its quantum coherence. Experimental realization of such quantum computers with diverse functional components in a planar monolithic device architecture is challenging due to material and thermodynamic mismatch between various elements. Furthermore, it requires complex control and routing, resulting in parasitic modes and reduced qubit coherence. Thus, a scalable interposer architecture is essential to merge and interconnect different functionalities within a sophisticated chip while maintaining qubit coherence. As such, heterogeneous integration is an optimum solution to scale the qubit technology. We propose a heterogeneously integrated quantum chip optoelectronics interposer as a solution to the high-density scalable qubit architecture. Our technology is high-volume manufacturable and provides novel optical I/O solutions for on-chip, chip-to-chip, and cryogenic-to-outside world interconnect.