Superconformal Ni Electrodeposition Using 2-Mercaptobenzimidazole
Superconformal Ni Electrodeposition Using 2-Mercaptobenzimidazole
复制标题
使用 2-巯基苯并咪唑进行超共形镍电沉积
DOI：
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发表时间：
2011
期刊：
影响因子：
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通讯作者：
T. Moffat
中科院分区：
文献类型：
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作者：
C. H. Lee;J. Bonevich;U. Bertocci;K. Steffens;T. Moffat
镍超保形填充亚微米沟槽的演示使用瓦特浴含有抑制剂2-巯基苯并咪唑（MBI）。滞后伏安法标记的MBI诱导的被动状态的击穿与Ni沉积的发病相一致。计时电流法表明，MBI抑制的破坏是浸泡条件和电位调节的强功能。从被动到主动的转变涉及电位依赖性MBI吸附与其随后的失活和/或在Ni沉积期间的消耗之间的竞争。MBI钝化层的击穿导致硫化物形成并将其并入Ni膜中。活性表面上Ni沉积的电流效率接近于无添加剂的电解质。对于凹陷的表面特征，例如沟槽，抑制击穿优先在底部拐角处开始。扫描和透射电子显微镜（SEM/TEM）的研究表明，在沟槽内的生长前沿最初开发的V形缺口形状，而可以忽略不计的沉积发生在自由表面上。这之后是Ni沉积在整个表面轮廓上的开始，其导致通过几何整平的沟槽填充。取决于试样浸泡过程中，一个独特的微观结构的转变标志着从超共形沉积模式的生长模式的变化，在沟槽填充的几何平整。
Ni superconformal filling of sub-micrometer trenches is demonstrated using a Watts bath containing an inhibitor 2-mercaptobenzimidazole (MBI). Hysteretic voltammetry marks the breakdown of the MBI-induced passive-state coincident with the onset of Ni deposition. Chronoamperometry reveals that disruption of MBI inhibition is a strong function of the immersion conditions and potential conditioning. The passive to active transition involves a competition between potential-dependent MBI adsorption and its subsequent deactivation and/or consumption during Ni deposition. Breakdown of the MBI-passivating layer results in sulfide formation and its incorporation into the Ni film. The current efficiency of Ni deposition on the activated surface is close to that for the additive-free electrolyte. For recessed surface features, such as trenches, inhibition-breakdown initiates preferentially at the bottom corners. Scanning and transmission electron microscopy (SEM/TEM) studies show the growth front within the trenches initially develops as a v-notch shape while negligible deposition occurs on the free surface. This is followed by the onset of Ni deposition over the entire surface profile that results in trench filling by geometrical leveling. Depending on the specimen immersion process a distinct microstructural transition marks the change in growth mode from a superconformal deposition mode to geometrical leveling during trench filling.