The effect of the Ni/Cu ratio on H-induced ductility loss and its mechanism in Cu?Ni binary alloy system
The effect of the Ni/Cu ratio on H-induced ductility loss and its mechanism in Cu?Ni binary alloy system
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Cu?Ni二元合金中Ni/Cu比例对H致塑性损失的影响及其机制
DOI：
10.1016/j.ijhydene.2021.09.140
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发表时间：
2021
影响因子：
7.2
通讯作者：
Yamabe Junichiro
中科院分区：
文献类型：
--
作者：
Wada Kentaro;Yamabe Junichiro
在Cu - Ni二元合金体系中研究了Ni/Cu比对氢脆（HE）行为的影响。当将HE敏感性分类为Ni分数的函数时，得到两种状态：状态1（其中Ni分数小于80 wt%）具有中等HE，状态2（其中Ni分数超过80 wt%）具有更严重的HE，尽管氢(H)诱导的晶间（IG）开裂被认为是H诱导降解的常见主要原因。通过- 196°C的慢应变速率拉伸试验，讨论了h -位错相互作用和/或动态h -扩散向晶界转移的必要性。具体来说，在状态1中，h -输运是触发IG开裂的必要条件。相反，在制度2中，这种h输运作用较小，最初沿GBs集中的氢会严重导致IG开裂。
The effect of the Ni/Cu ratio on hydrogen embrittlement (HE) behavior is studied in the context of the Cu–Ni binary alloy system. When classifying HE sensitivity as a function of the Ni fraction, two regimes are obtained: Regime 1 (wherein Ni fraction is less than 80 wt%) with moderate HE and Regime 2 (where Ni fraction exceeds 80 wt%) with more severe HE, although hydrogen- (H-)induced intergranular (IG) cracking is noted to be the common primary cause of H-induced degradation. Necessities of H-transportation towards grain boundaries (GBs) via H–dislocation interaction and/or dynamic H-diffusion are discussed via the slow strain rate tensile tests at −196 °C. Specifically, in Regime 1, H-transportation is necessary for the triggering of IG cracking. Conversely, in Regime 2, such H-transportation plays a minor role and the initially concentrated hydrogen along GBs can sorely cause IG cracking.