Post-routing redundant via insertion for yield/reliability improvement
Post-routing redundant via insertion for yield/reliability improvement
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DOI：
10.1145/1118299.1118376
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发表时间：
2006-01
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影响因子：
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通讯作者：
Kuang‐Yao Lee;Ting-Chi Wang
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文献类型：
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作者：
Kuang‐Yao Lee;Ting-Chi Wang
减少过孔失效造成的成品率损失是可制造性设计中的重要问题之一。提高通孔成品率/可靠性的一种众所周知且强烈推荐的方法是增加多余的通孔。本文研究了后布线冗余通孔插入问题，并将其描述为一个最大独立集问题。我们提出了一种高效的图构造算法来对问题进行建模，并提出了一种有效的管理信息系统启发式算法来解决该问题。实验结果表明，与商业工具和现有方法相比，我们的管理信息系统启发式算法插入了更多的冗余通孔，并在通孔层之间更均匀地分配了冗余通孔。插入的冗余过孔数最多可增加21.24%。此外，由于冗余过孔可分为在轨和离轨过孔，而在轨过孔具有更好的电学性能，因此我们还提出了两种增加在轨冗余过孔数量的方法(一种是从管理信息系统启发式改进而来，另一种是作为后处理器)。实验结果表明，这两种方法都取得了很好的效果。
Reducing the yield loss due to via failure is one of the important problems in design for manufacturability. A well known and highly recommended method to improve via yield/reliability is to add redundant vias. In this paper, we study the problem of post-routing redundant via insertion and formulate it as a maximum independent set (MIS) problem. We present an efficient graph construction algorithm to model the problem, and an effective MIS heuristic to solve the problem. The experimental results show that our MIS heuristic inserts more redundant vias and distributes them more uniformly among via layers than a commercial tool and an existing method. The number of inserted redundant vias can be increased by up to 21.24%. Besides, since redundant vias can be classified into on-track and off-track ones, and on-track ones have better electrical properties, we also present two methods (one is modified from the MIS heuristic, and the other is applied as a post processor) to increase the amount of on-track redundant vias. The experimental results indicate that both methods perform very well.