In Situ Surface X-Ray Diffraction Studies of the Influence of the PEG-Cl-Complex on Homoepitaxial Electrodeposition on Cu(001)

In Situ Surface X-Ray Diffraction Studies of the Influence of the PEG-Cl-Complex on Homoepitaxial Electrodeposition on Cu(001)
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DOI:
10.1149/2.027312jes
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发表时间:
2013
影响因子:
3.9
通讯作者:
F. Golks;Y. Gründer;A. Drünkler;J. Roy;J. Stettner;J. Zegenhagen;O. Magnussen
F. Golks;Y. Gründer;A. Drünkler;J. Roy;J. Stettner;J. Zegenhagen;O. Magnussen
中科院分区:
工程技术4区
文献类型:
--
作者:
F. Golks;Y. Gründer;A. Drünkler;J. Roy;J. Stettner;J. Zegenhagen;O. Magnussen

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利用原位表面X射线衍射研究了聚乙二醇(PEG)对Cu(001)在氯化物电解液中原子尺度界面结构和Cu生长行为的影响。在无Cu溶液中的研究明确地证实了在聚合物存在下有序c(2× 2)氯化物吸附层的存在以及可逆的Cl吸附/脱附和吸附层中的有序-无序转变。部分有序的氯化物吸附层被发现在一个更宽的电位范围内相比,PEG-无电解质,这表明吸附物相的稳定。晶体截断和超结构棒状测量表明,在饱和覆盖度下,聚合物与部分c(2× 2)Cl覆盖的表面的相互作用比与紧密堆积的c(2× 2)吸附层的相互作用更强.在含Cu电解质中,在相对于Ag/AgCl ≤− 0.35 V的电位下观察到逐层生长。与不含PEG的电解质相比,沉积速率显著降低,提供了原子尺度上抑制的明确证据。在更积极的潜力交叉到3D的增长和增加表面粗糙度。
The influence of polyethylene glycol (PEG) on the atomic-scale interface structure and Cu growth behavior of Cu (001) in chloride-containing electrolyte was investigated by in situ surface X-ray diffraction. Studies in Cu-free solution unambiguously verify the presence of the ordered c (2× 2) chloride adlayer in the presence of the polymer as well as reversible Cl adsorption/desorption and an order-disorder transition in the adlayer. The partially ordered chloride adlayer is found over a wider potential range as compared to PEG-free electrolyte, indicating stabilization of this adsorbate phase. Crystal truncation and superstructure rod measurements reveal that the polymer interacts more strongly with the partially c (2× 2) Cl covered surface than with the close-packed c (2× 2) adlayer at saturation coverage. In Cu-containing electrolyte layer-by-layer growth was observed at potentials≤− 0.35 V vs. Ag/AgCl. The deposition rate was significantly reduced as compared to PEG-free electrolyte, providing clear evidence of inhibition on the atomic-scale. At more positive potentials a crossover to 3D growth and increasing surface roughness is found.