Mechanical nanoprocessing of layered crystal structure materials by atomic force microscopy
Mechanical nanoprocessing of layered crystal structure materials by atomic force microscopy
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DOI：
10.1143/jjap.41.5706
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发表时间：
2002-09-01
期刊：
影响因子：
--
通讯作者：
Matsuzaki, K
中科院分区：
文献类型：
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作者：
Miyake, S;Matsuzaki, K
基于晶体结构的各向异性，我们尝试了用原子力显微镜通过尖端滑动对具有层状晶体结构的材料进行纳米尺度的机械加工。通过机械操作一个锋利的尖端。处理主要发生在等于多层晶体结构周期的倍数的深度。通过在二硫化钼和白云母的机械加工中应用该机理，可以在具有周期性弱昂德瓦尔斯键的多层晶体材料的层周期单元中进行线和交叉槽的高精度切割加工。然而，在石墨的加工中，基面的结合强度非常高，使得难以进行必要的纳米级切割加工。因此，为了利用石墨基面的高结合强度，尝试并实现了纳米级石墨基面的弯曲加工。
We attempted the nanometer-scale mechanical processing of materials with a layered crystal structure by tip sliding with an atomic force microscope, based on the anisotropy of the crystal structures. By mechanically operating a sharp tip. processing mainly occurs to depths equivalent to multiples of the period of the multilayered crystal structure,,. corresponding to the depth from the surface of one cleavap plane to the surface of the cleavage plane beneath it. By applying this mechanism in the mechanical processing of molybdenum disulfide and muscovite mica, high-precision cutting processing of lines and cross grooves can be performed in a layer-period unit of a multilayered crystal material that has periodic weak an der Waals bonds. However, in the processing of graphite, the bond strength of the basal plane is very high, making it difficult to perform the essential nanometer-scale cutting processing. Therefore, to utilize the high bond strength of its basal plane, the bending processing of the graphite basal plane on the nanometer scale was attempted and realized.