Size effects in the fatigue behavior of thin Ag films
Size effects in the fatigue behavior of thin Ag films
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DOI：
10.1016/s1359-6454(02)00391-9
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发表时间：
2003-01
期刊：
影响因子：
9.4
通讯作者：
R. Schwaiger;O. Kraft
中科院分区：
文献类型：
--
作者：
R. Schwaiger;O. Kraft
薄膜的尺寸和微观结构会影响疲劳的微观过程。这项工作的重点是表征这种机制和由此产生的疲劳行为。研究了SiO_2表面0.2-1.5 μm厚Ag膜的疲劳行为。使用悬臂梁微束偏转相对于加载条件的影响进行测试的膜。在循环加载后，在Ag膜表面发现类似于在散装材料中观察到的挤出。在挤出物下方观察到的空隙，靠近薄膜-基材界面，对疲劳失效有显著影响。疲劳损伤主要发生在（100）取向的晶粒中。较薄的膜更耐疲劳，并且比较厚的膜包含更少、更小的挤出物。
Thin film dimensions and microstructure affect the microscopic processes responsible for fatigue. This work focuses on the characterization of such mechanisms and the resulting fatigue behavior. The fatigue behavior of 0.2–1.5 μm thick, Ag films on SiO2was investigated. The films were tested using cantilever microbeam deflection with respect to the influence of loading conditions. Extrusions similar to those observed in bulk material were found at the Ag film surfaces after cyclic loading. Voids observed beneath the extrusions, close to the film-substrate interface, contributed significantly to fatigue failure. Fatigue damage was observed to occur predominantly in (100)-oriented grains. Thinner films were more fatigue resistant and contained fewer, smaller extrusions than thicker films.