Laser-induced front side etching of fused silica with femtosecond laser radiation using thin metal layers
Laser-induced front side etching of fused silica with femtosecond laser radiation using thin metal layers
复制标题
DOI：
10.1016/j.apsusc.2012.11.047
复制
发表时间：
2013-08
影响因子：
6.7
通讯作者：
P. Lorenz;M. Ehrhardt;K. Zimmer
中科院分区：
文献类型：
--
作者：
P. Lorenz;M. Ehrhardt;K. Zimmer
激光诱导正面刻蚀(LIFE)是一种使用薄吸收体层对透明材料进行激光刻蚀的方法。在本研究中，利用飞秒钛宝石激光(λ=780 nm，Δtp=150fs，f=1 kHz)，采用铬层作为吸收层，在熔融石英中刻蚀沟槽。研究了熔融二氧化硅的刻蚀过程与激光注量、激光脉冲数以及金属吸收层厚度的关系。重点讨论了不同工艺参数对表面形貌、刻蚀深度和表面改性的影响。用白光干涉法对刻蚀沟槽进行了分析。对于厚度为5~50 nm的金属层，单激光脉冲熔融二氧化硅的寿命过程的注量窗口为0.5~2.5J/cm2。测得的最大刻蚀深度约为100 nm，表明该寿命工艺适用于精密加工。用热力学模型模拟飞秒激光寿命过程的尝试是中等成功的，与实验结果有显著差异。
Laser-induced front side etching (LIFE) is a method for laser etching of transparent materials using thin absorber layers. In this study, chromium layers were applied as absorber for etching trenches in fused silica with femtosecond Ti:sapphire laser radiation (λ=780nm, Δtp=150fs, f=1kHz). The etching process of fused silica is studied in dependence on the laser fluence, the laser pulse numbers as well as metal absorber layer thicknesses. Especially the influence of the varied parameters on the surface morphology, the etching depth, and the surface modification is presented and discussed. The etched trenches were analyzed with white light interferometry. A fluence window from 0.5 to 2.5J/cm2for the LIFE process of fused silica with a single laser pulse using a metal layer with a thickness from 5 to 50nm was found. The measured maximum etching depth of approximately 100nm suggests that the LIFE process is appropriated for precision machining. The attempt to simulate the fs laser LIFE process by a thermodynamic model was moderate successfully and exhibits significant differences within the experimental results.