Characterization and Modeling of K-Band Coplanar Waveguides Digitally Manufactured Using Pulsed Picosecond Laser Machining of Thick-Film Conductive Paste
Characterization and Modeling of K-Band Coplanar Waveguides Digitally Manufactured Using Pulsed Picosecond Laser Machining of Thick-Film Conductive Paste
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使用脉冲皮秒激光加工厚膜导电浆料数字化制造的 K 波段共面波导的表征和建模
DOI:
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发表时间:
2017
影响因子:
4.3
通讯作者:
T. Weller
中科院分区:
文献类型:
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作者:
E. Rojas;H. Tsang;P. Deffenbaugh;Ramiro A. Ramirez;D. Hawatmeh;A. Ross;K. Church;T. Weller
Microdispensing of thick-film conductive paste has been demonstrated as a viable approach for manufacturing microwave planar transmission lines. However, the performance and upper frequency range of these lines is limited by the cross-sectional shape and electrical conductivity of the printed paste, as well as the achievable minimum feature size which is typically around <inline-formula> <tex-math notation="LaTeX">$100~mu ext{m}$ </tex-math></inline-formula>. In this paper, a picosecond Nd:YAG laser is used to machine slots in a 20–25-<inline-formula> <tex-math notation="LaTeX">$mu ext{m}$ </tex-math></inline-formula>-thick layer of silver paste (Dupont CB028) that is microdispensed on a Rogers RT5870 substrate, producing coplanar waveguide (CPW) transmission lines with 16–<inline-formula> <tex-math notation="LaTeX">$20~mu ext{m}$ </tex-math></inline-formula>-wide slots. It is shown that the laser solidifies an about 2-<inline-formula> <tex-math notation="LaTeX">$mu ext{m}$ </tex-math></inline-formula>-wide region of the edges of the slots, thus significantly increasing the effective conductivity of the film and improving the attenuation constant of the lines. The extracted attenuation constant at 20 GHz for laser machined CB028 is 0.74 dB/cm. CPW resonators and filters show that the effective conductivity is in the range from 10 to 30 MS/m, which represents a <inline-formula> <tex-math notation="LaTeX">$100 imes $ </tex-math></inline-formula> improvement when compared to the values obtained with the exclusive use of microdispensing. This paper demonstrates that a hybrid approach of additive manufacturing and laser machining enables the fabrication of higher frequency circuits (up to at least 40 GHz) with improved performance.