Electrodeposition of CuSn Alloy from Sulfosuccinate Bath
Electrodeposition of CuSn Alloy from Sulfosuccinate Bath
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磺基琥珀酸盐浴电沉积 CuSn 合金
DOI：
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发表时间：
2004
期刊：
影响因子：
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通讯作者：
H. Nawafune
中科院分区：
文献类型：
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作者：
Toshihiro Nakamura;Y. Mizutani;T. Nagayama;Nagamasa Shinohara;H. Nawafune
电沉积白青铜（镜质：Cu-Sn 40mass%）是镍镀层的替代品。在0.1474mol/L CuSO4、0.0526mol/L SnSO4、1.0mol/L磺基琥珀酸、0.4mol/L L-甲硫氨酸和3g/L聚氧乙烯-α-萘酚的镀液中，在0.5 ~ 4A/dm2的电流密度和25℃的温度下沉积了40mass%的铜锡合金薄膜。l -蛋氨酸和聚氧乙烯-α-萘酚的共存在一个高电位范围内显著抑制了铜的沉积，并显著减少了亚反应。所制得的铜锡合金膜为银白色。出水中的铜、锡离子以氢氧化物的形式分离，上述浴槽中锡、铜离子残留浓度降至5mg/L以下。
Electrodeposited White bronze (speculum : Cu-Sn 40mass%) shows promise as an alternative to nickel coating. Copper-tin(40mass%) alloy film was deposited over a current density range from 0.5 to 4A/dm2 and at a temperature of 25oC in the following bath composition : 0.1474mol/L CuSO4, 0.0526mol/L SnSO4, 1.0mol/L sulfosuccinic acid, 0.4mol/L L-methionine and 3g/L polyoxyethylene-α-naphthol. The coexistence of L-methionine and polyoxyethylene-α-naphthol markedly inhibited the deposition of copper over a noble potential range, and markedly reduced subreaction.The copper-tin(40mass%) alloy film obtained was silvery white. Copper and tin ions in the effluent were separated as hydroxide, and the residual concentration of tin and copper ions in the bath shown above decreased to less than 5mg/L.